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• Time of issue:2024-06-28 15:22
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(Summary description)Tokyo Electrion (TEL, Tokyo Electrion), Asia's largest semiconductor factory Miyagi president Hiromitsu Kamihara said in a joint interview with Taiwan media today that in response to changes in The Times, the rapid development of generative AI and the restart of capital expenditure in the memory industry, TEL has developed a new medium-term development strategy to adopt an active offensive strategy. It plans to invest 1.5 trillion yen (about $10 billion) from fiscal year 2025 to fiscal year 2029, and recruit 10,000 new blood to enjoy AI business opportunities, and aims to become the world's largest semiconductor equipment manufacturer. TEL currently ranks fourth in the global market, only after ASML of the Netherlands, Applied Materials of the United States, and Colin R & D. But TEL is the world's only semiconductor process related to deposition, film, coating development and cleaning four process equipment, and its unique probe machine, is the recent hot CoWoS and co-packaged optical components (CPO) and other advanced packaging key equipment. In other words, when all AI chips need to be produced through wafer foundries, the semiconductor equipment required for the production of AI chips in wafer foundries is mostly provided by TEL. In particular, the semiconductor process into the Hing NA (high numerical aperture) extreme ultraviolet light (EUV) microimaging equipment, more need highly conductive coating development equipment, improve the positive circuit precision, and TEL's current coating development equipment, almost must be closely connected with ASML, so that TEL in this part of the market share of 100%. Kamihara Hiromitsu stressed that TEL's recent development strategy has shifted to an active offensive strategy, mainly optimistic about digital transformation, chip refinement, and AI server related AI accelerators, graphics processors (Gpus) and high-frequency memory, which need to be imported into TEL's equipment to improve chip performance and improve energy consumption and carbon emissions. Accordingly, TEL has decided to increase R&D investment and staff expansion over the next five years. He said TEL plans to invest 1.5 trillion yen ($10 billion) in research and development over the next five years, an increase of up to 80 percent from the previous five-year plan. At the same time, the next five years will also expand the recruitment of 10,000 new blood, in other words, an increase of 2,000 people per year, to meet the market's demand for new product development and equipment. TEL also first exposed the R&D center in Miyagi Prefecture and the largest etching equipment production center in the world. It is understood that this production center in addition to the production of 3nm surround gate (GAA) for customers and 2nm Nanosheet (Nanosheet), is also working on the development of updated coating development equipment below 1nm. Presumably in close cooperation with the Taiwan Defense Sacred Mountain. At the same time, a third R&D center will be built, which is scheduled to be completed and opened in spring 2025. It is understood that the TEL Taiwan branch of Tokyo Electronics Hsinchu Research and Development Center is also expanding the original one-floor clean room to three floors, mainly with the most important customers in Taiwan to simultaneously promote advanced logic front and back chip detection equipment. At the same time, in order to be close to customers' mass production and rapid response, Tainan has also set up an operation center to serve customers nearby. In TEL's revenue last year, AI application-related equipment revenue accounted for 30%, which is also the key to support TEL's decision to expand its military and challenge the world's largest semiconductor equipment manufacturer.